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CU • News & Events

Clarkson Ph.D. Student Wins Best Paper Award for Research

Release Date
Tuesday August 9, 2022
Prof. Avram Bar-Cohen Best Paper Award in the Emerging Technologies and Fundamentals Track

Lin Jiang, a Ph.D. student in Electrical and Computer Engineering at Clarkson University, recently received the Prof. Avram Bar-Cohen Best Paper Award in the Emerging Technologies and Fundamentals Track for his research work on “Chip-level Thermal Simulation for a Multicore Processor Using a Multi-Block Model Enabled by Proper Orthogonal Decomposition”. He received the award at The Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Itherm 2022) in San Diego, California. Other co-authors of this paper include Anthony Dowling, a PhD. student of Electrical and Computer Engineering, Yu Liu and Ming-Cheng Cheng. 

Lin is jointly advised by Dr. Yu Liu, Assistant Professor of Software & Computer Engineering and Dr. Ming-Cheng Cheng, Professor in Electrical Engineering at Clarkson.  IEEE Itherm is a prestigious international intersociety conference for academic and industrial communities to explore thermal, thermomechanical and emerging technology issues associated with electronic devices, packages and systems.

Lin's research involves the development of an innovative computational methodology for full-chip thermal simulations of multi-core CPUs and general purpose GPUs enabled by a physics-based data-driven learning algorithm. The approach partitions an entire semiconductor chip into standard building blocks and the simulation model for each block is then developed and stored in a database. The work significantly minimizes the training resources needed in the typical learning algorithm and facilitates efficient parallel computing.  It has been shown that this multi-block learning approach offers a very accurate prediction of the dynamic thermal profile of the entire chip with a computational speedup over a few thousand times, compared to direct numerical methods.  Accurate full-chip thermal simulation for capturing hot spots in high-performance CPUs and GPUs has been a very challenging task due to the intensive computational effort needed in accurate direct numerical simulation.  Dr. Cheng says, "The recognition by the Itherm 2022 committee under the track of “Emerging Technologies and Fundamentals” strongly indicates that Lin’s research offers a significant contribution to the emerging thermal management issue that is becoming critical in high-performance computing environments."  

As a private, national research university, Clarkson is a leader in technological education and sustainable economic development through teaching, scholarship, research and innovation. We ignite personal connections across academic fields and industries to create the entrepreneurial mindset, knowledge and intellectual curiosity needed to innovate world-relevant solutions and cultivate the leaders of tomorrow. With its main campus located in Potsdam, N.Y., and additional graduate program and research facilities in the New York Capital Region, Beacon, N.Y., and New York City, Clarkson educates 4,600+ students across 95 rigorous programs of study in engineering, business, the arts, education, sciences and health professions. Our alumni earn salaries that are among the top 2.5% in the nation and realize accelerated career growth. One in five already leads as a CEO, senior executive or owner of a company. To learn more about Clarkson University, go to www.clarkson.edu.


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News directors and editors: For more information, contact Melissa Lindell, Director of Media Relations, at 315-268-6716 or mlindell@clarkson.edu.

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