News & Events
Clarkson University Center for Advanced Materials Processing Sponsors International Symposium
[A photograph for media use is available at http://www.clarkson.edu/news/photos/cmp2009.jpg ]
Researchers from high technology companies and suppliers, and universities in the United States, Japan, Korea, Belgium and Germany gathered in Lake Placid earlier this month for the 14th International Symposium on Chemical-Mechanical Planarization (CMP), sponsored by Clarkson University’s Center for Advanced Materials Processing (CAMP).
Chemical-mechanical planarization or chemical-mechanical polishing, CMP for short, is a process that uses nano-sized abrasives in a reactive, chemical slurry to polish various layers on the surface of wafers used in semiconductor fabrication to achieve nanolevel planarity.
CMP plays an increasingly important role in today’s microelectronics industry. It is the ideal, and the only planarizing technology for use with the interlayer dielectrics and metal films used in silicon integrated circuit fabrication.
CMP is an enabling technology that translates into faster computers, more realistic video games, smaller cell phones and more efficient performance from the various electronic devices we use daily in our homes and businesses.
Distinguished University Professor and CAMP Director S.V. Babu of Clarkson University was the lead organizer and co-chair of the symposium.
He was assisted by co-organizers Lee Cook, technology fellow, Dow Electronic Materials; Mahadevaiyer Krishnan, research scientist & manager, Colloid & Interface Science - Advanced Planarization, IBM; Yuzhuo Li, R&D head for Global Business Unit Electronic Materials at BASF and Professor of Chemistry at Clarkson; and Jin-Goo Park, professor, Department of Materials Engineering, Hanyang University.
This year’s symposium focused on several fundamental aspects of CMP, which included abrasive particles, polishing mechanisms, pad behavior, flow characterization, defects and post-polish cleaning, low-k films and integration issues, 300 mm wafer challenges and MEMS/MOEMS (micro-electro-mechanical systems/micro-opto-electro-mechanical systems).
Invited speakers from end-users, tool, pad and slurry manufacturers, and universities presented their research results. The Symposium also included three, one-hour workshops.
These tutorials were presented by Dr. Len Borucki of Araca Incorporated (Pads in all their Glory), Dean/Professor Goodarz Ahmadi of Clarkson University (Overview of Models for Chemical Mechanical Planarization), and Distinguished University Professor/CAMP Director S.V. Babu (Slurry Options and Impact on some Defects for Cu, Barrier and Dielectric Planarization). In addition, a poster session was held to display the CMP research taking place at CAMP.
Clarkson University President Tony Collins delivered an after-dinner keynote speech. His presentation focused on "Innovation and the Economy." He also presented award plaques to Adele Connors and Sharon Williams (both of Adworkshop, Lake Placid, N.Y.) for their excellent work with CAMP newsletters over the years.
Clarkson University launches leaders into the global economy. One in six alumni already leads as a CEO, VP or equivalent senior executive of a company. Located just outside the Adirondack Park in Potsdam, N.Y., Clarkson is a nationally recognized research university for undergraduates with select graduate programs in signature areas of academic excellence directed toward the world’s pressing issues. Through 50 rigorous programs of study in engineering, business, arts, sciences and health sciences, the entire learning-living community spans boundaries across disciplines, nations and cultures to build powers of observation, challenge the status quo, and connect discovery and engineering innovation with enterprise.
Photo Caption: Co-organizers of the 14th International Symposium on Chemical-Mechanical Planarization. Left to right: S.V. Babu (Distinguished University Professor / CAMP Director, Clarkson University), Lee Cook (Technology Fellow, Dow Electronic Materials), Yuzhuo Li (R&D Head for Global Business Unit Electronic Materials at BASF and Professor of Chemistry at Clarkson University) and Jin-Goo Park (Professor, Department of Materials Engineering, Hanyang University).