The Center for Advanced Materials Processing (CAMP) at Clarkson University and the CMP Users Group North America have announced the 22nd International Symposium on Chemical-Mechanical Planarization (CMP), August 12-15, 2018 in Lake Placid, NY.
Chemical-Mechanical Planarization has come to occupy a central role in many industrially important technologies. This workshop, to be held in a Gordon conference type format, will focus on several fundamental aspects of CMP.
Invited speakers from end users; tool, pad, and slurry manufacturers; and universities will present their recent research results. As has been the practice in recent years, a poster session will be organized on the afternoon of August 13.
See below for complete details: