CAMP Annual Report: Page 8
Clarkson University's Center for Advanced Materials Processing Organizes the 18th Annual International Symposium on Chemical-Mechanical Planarization
Over 100 researchers from several high technology companies, suppliers and universities from the United States, Japan, Korea, China, Taiwan, Belgium, and Canada, gathered in Lake Placid during August 11-14, 2013 for the 18th International Symposium on Chemical-Mechanical Planarization (CMP), sponsored by Clarkson University’s Center for Advanced Materials Processing (CAMP). Speakers included engineers/scientists from IBM, Intel, Micron, GLOBALFOUNDRIES, Samsung, SEMATECH, Ebara, Dow Electronic Materials, Cabot Micro, Applied Materials, Pall, Entegris, Fujimi, Fujiplanar, IMEC in Belgium and others. University speakers were from Kyushu University and Kyushu Institute of Technology, and Shizuoka from Japan, SKKU and Hanyang from Korea, National Taiwan University, and CNSE and Clarkson.
Chemical-mechanical planarization or chemical-mechanical polishing -CMP for short - is a process that uses nano-sized abrasives in a reactive chemical dispersion to polish various layers on the surface of wafers used in semiconductor fabrication to achieve nanolevel planarity (a flat and uniformly smooth surface). CMP is an enabling technology that translates into faster computers, more realistic video games, smaller cell phones and more efficient performance from the various electronic devices we use daily in our homes and businesses. Since the wafers typically have a 300 mm diameter, this planarity extends over an eight-orders-of-magnitude length scale. This technology plays a critical role in today’s microelectronics industry and is the ideal planarizing technology for use with the interlayer dielectrics and metal films used in all forms of logic and memory devices extending down to14 nanometer feature sizes. Clarkson University and CAMP are internationally recognized for expertise in this remarkable technology.
A poster session emphasizing CAMP’s research in Chemical-Mechanical Planarization (CMP) was dedicated to the memory and contributions of Dr. Yuzhuo Li. He was the Head of Research and Development for Global Business Electronic Materials at BASF in Ludwigshafen, Germany, and also served as a professor in Clarkson University’s Department of Chemistry. From left: Distinguished University Professor and CAMP Director S.V. Babu, Clarkson University President Anthony Collins, Dr. Kenneth Rushing (Research Assistant Professor and LASP Manager at Clarkson and a former graduate student for Professor Yuzhuo Li), and CAMP Deputy Director Jack Prendergast.
Organizers of the 18th International Symposium on Chemical-Mechanical Planarization held in Lake Placid. From left: Charan Surisetty (Unit Process Engineering Professional at IBM), Hirokuni Hiyama (Division Executive for Technologies, R&D, IP Division at Ebara Corporation in Japan), Distinguished University Professor and CAMP Director S.V. Babu, and Jin-Goo (Professor, Department of Materials Engineering and Vice Dean at Hanyang University in Korea).
Several symposium attendees join the After Dinner Speaker Mark Dougherty (IBM Director – Unit Process Development, SRDC- IBM Microelectronics Division). From Left: Hirokuni Hiyama (Division Executive for Technologies, R&D, IP Division at Ebara Corporation in Japan), Chao-Chang. Arthur Chen (Director of the CMP Innovation Center and Distinguished Professor in the Department of Mechanical Engineering at National Taiwan University of Science and Technology, Taiwan), S.V. Babu (Distinguished University Professor/CAMP Director, Clarkson University), After Dinner Speaker Mark Dougherty, Clarkson University President Anthony Collins, Greg Akiki of IBM (Director, G450c), and CAMP Deputy Director Jack Prendergast.