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Clarkson University’s Center for Advanced Materials Processing Sponsors Chemical-Mechanical Planarization Symposium
[A photograph for media use is available at http://www.clarkson.edu/news/photos/cmp2008.jpg .]
More than 100 of the world's premier researchers, academics, high technology companies and suppliers gathered in Lake Placid August 10-13 for the 13th International Chemical-Mechanical Planarization (CMP) Symposium, sponsored by Clarkson University's Center for Advanced Materials Processing (CAMP).
CMP is playing an increasingly important role in today's microelectronics industry. It is the ideal, and the only planarizing technology for use with the interlayer dielectrics and metal films used in silicon integrated circuit fabrication. CMP is an enabling technology that translates into faster computers, more realistic video games, smaller cell phones and smaller, more efficient performance from the electronic devices we use daily in our homes and businesses.
This year's Symposium focused on several fundamental aspects of CMP, which included particles, polishing mechanisms, pad behavior, flow characterization, defects and post-polish cleaning, low-k films and integration issues, 300 mm wafer challenges and MEMS/MOEMS (micro-electro-mechanical systems/micro-opto-electro-mechanical systems).
Invited speakers from end-users, tool, pad and slurry manufacturers, and universities presented their research results. In addition Joseph Steigerwald (engineering group leader for Intel Corporation's Portland Technology Development) gave an after-dinner presentation, titled "Challenges of Integrating CMP."
Clarkson Distinguished University Professor and CAMP Director S.V. Babu was the leading organizer and co-chair of the symposium. Additional co-organizers included Manabu Tsujimura, managing executive officer and deputy group executive of Ebara Corporation in Japan, Mansour Moinpour, engineering manager for materials enabling and path finding programs of Intel Corporation, Mahadevaiyer Krishnan, research scientist and manager for colloid and interface science, Advanced Planarization Group of IBM, and CAMP Professor Yuzhuo Li.
In addition, the following U.S. companies were in attendance: NXP, IBM, Pall Corporation, Texas Instruments, Fujimi Corporation, Intel, SKW Associates, Inc., NexPlanar, Araca Incorporated, Air Products, Semplastics, Saint Gobain, Cabot Microelectronics Corporation, innoPad Inc., Rohm & Haas, Ferro Corporation, AMD, Nyacol Nano Technologies, Inc., Degussa Corporation, JSR Micro Inc., 3M, W.R. Grace, Entegris, Inc., and Morgan Advanced Ceramics, Inc.
Clarkson University launches leaders into the global economy. One in six alumni already leads as a CEO, VP or equivalent senior executive of a company. Located just outside the Adirondack Park, Clarkson is a nationally recognized research university for undergraduates with select graduate programs in signature areas of academic excellence directed toward the world's pressing issues. Through 50 rigorous programs of study in engineering, business, arts, sciences and health sciences, the entire learning-living community spans boundaries across disciplines, nations and cultures to build powers of observation, challenge the status quo, and connect discovery and engineering innovation with enterprise.
Photo Caption: Co-organizers of the 13th International Symposium on Chemical -Mechanical Planarization, sponsored by Clarkson University's Center for Advanced Materials Processing (CAMP). From left: CAMP Professor Yuzhuo Li, Mansour Moinpour, engineering manager for materials enabling and path finding programs of Intel Corporation, Manabu Tsujimura, managing executive officer and deputy group executive of Ebara Corporation in Japan, Clarkson Distinguished University Professor and CAMP Director S.V. Babu, and , Mahadevaiyer Krishnan, research scientist and manager for colloid and interface science, Advanced Planarization Group of IBM.