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CAMP June Newsletter: Page 2

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CAMP to Sponsor Eighteenth International Symposium on Chemical - Mechanical Planarization

CAMP will sponsor its Eighteenth International Symposium on Chemical-Mechanical Planarization during the month of August.  The three-day symposium/workshop will be held (August 11-14, 2013) at the Crowne Plaza Resort & Golf Club in Lake Placid, New York. 

It will include presentations by industrial and university representatives and a poster session.  The workshop, to be held in a Gordon conference type format, will focus on several fundamental aspects of chemical-mechanical planarization including particle and colloidal aspects, polishing mechanisms, pad/conditioning behavior, flow characterization, Cu/barrier film planarization, defects and post-polish cleaning, low-k films and integration issues, 300 mm wafer issues, MEMS / MOEMS, as well as STI, Nitride/Poly, etc. polishing. 

The co-organizers of this year’s International CMP Conference are: S.V. Babu (Distinguished University Professor and CAMP Director, Clarkson University), Hirokuni Hiyama ( Division Executive for Technologies, R&D, IP Division at Ebara Corporation in Japan), Jin-Goo Park ( Professor, Department of Materials Engineering at Hanyang University in Korea), Charan Surisetty (Unit Process Engineering Professional at IBM),  Joseph Steigerwald (Intel Fellow; Technology and Manufacturing Group and Director of Chemical Mechanical Polish Technology), Matt Prince (Principal Engineer, Intel), Lee Cook (Technology Fellow and Global Slurry R&D Director, Dow Electronic Materials), and Rajeev Bajaj (Director at Applied Materials).


Novartis joins CAMP as a new Corporate Sponsor.

Konica Minolta joins CAMP as a new Corporate Member.