CAMP June Newsletter: Page 1
CAMP’s Annual Technical Meeting Featured Two Speakers
From left: CEO of Albany International Corporation Frank Schmeler (member of Clarkson University’s Board of Trustees), Keynote Speaker Congressman Paul Tonko, Professor Egon Matijevic (the Victor K. LaMer Chair of Colloid and Surface Science at Clarkson University), Distinguished University Professor / CAMP Director S.V. Babu, and Edward Reinfurt (Director of the Division of Science, Technology & Innovation, Empire State Development).
From left: Donald Canaperi (Senior Engineer at IBM), Dr. Robert Villetto (Process Engineering Manager, Albany Nanotech, IBM Corporation), Professor Egon Matijevic (the Victor K. LaMer Chair of Colloid and Surface Science at Clarkson University), Keynote Speaker George Gomba (VP for Unit Process Development, Semiconductor Research & Development Center, IBM), Distinguished University Professor / CAMP Director S.V. Babu, and CAMP Deputy Director Jack Prendergast.
CAMP Annual Technical Meeting
CAMP’s Annual Technical Meeting was held May 18 - 20, 2011, at the Holiday Inn in Albany, New York. The objective of this meeting was to provide a forum for an exchange of ideas and information between university and industry researchers involved in fine particle processing and nanotechnology and related colloid and surface aspects as well as applications. It included
representatives of Industry, University, and New York State Economic Development Organizations. The keynote speakers were Congressman Paul Tonko and George Gomba (VP for Unit Process Development, Semiconductor Research & Development Center, IBM). Congressman Tonko’s keynote address emphasized the importance of a good education for all levels of learning (Pre-K – Graduate School). The title of the keynote address presented by VP Gomba, was “Chip Technology is Changing the World.”
Professor Egon Matijevic' (the Victor K. LaMer Chair of Colloid and Surface Science at Clarkson University) and Professor S.V. Babu (Distinguished University Professor and CAMP Director) coauthored a highly cited article. Their paper, “Colloid Aspects of Chemical –Mechanical Planarization,” has recently been recognized in the “Top-50 Most Cited Articles,” as published in the Journal of Colloid and Interface Science (2008-2009).
Chemical-Mechanical Planarization refers to the process whereby a wafer’s surface is made smooth by polishing it with a slurry containing abrasives of finely dispersed particles. The authors review article describes the colloid approach for optimizing materials and approaches in order to achieve desirable polish rates and final surfaces with no imperfections.