Technology Transfer Partnerships with CAMP

Corporate Sponsors

Corning*
Ferro Electronic Material Systems*
IBM*
Kodak*
Xerox*
Procter and Gamble
Wyeth*

Corporate Members

Cabot Microelectronics
Climax Molybdenum Company
Dynea
EBARA Technologies Incorporated
G M Powertrain*
Metabolix
NanoDynamics Inc.*
Novellus Systems, Inc.
NYACOL
Nano Technologies,Inc.
PPG Industries, Inc.
Praxair*
Rodel, Inc
Sachem
Saint Gobain Industrial Ceramics
W.R. Grace & Company
TBW

New York State Associates *

Buffalo Wire Works Co., Inc.
DeFelsko Corporation
Ferronics Incorporated
Hoosier Magnetics, Inc.
Indium Corporation of America
OPTIMAX
REYNOLDSTECH
Unifrax Corporation
Universal Photonics, Inc.
Infotonics Technology Center Inc.

Government Sponsors

New York State Office of Science , Technology, and Academic Research (NYSTAR)
Department of Defense
Department of Energy
National Science Foundation
New York State Energy Research and Development Authority (NYSERDA)

* New York State

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In addition Clarkson Distinguished Professor Goodarz Ahmadi's (Robert R. Hill '48 Professorship) work with Xerox involves the study of electrohydrodynamic flows during a corona discharge in an electrophotographic machine. Professor Ahmadi and his collaborators have developed a computational model for analyzing gas electrohydrodynamic flows and the transport and deposition of charged toner particles in the presence of a strong electric field. They showed that electrohydrodynamics could strongly affect the transport and deposition of small particles in corona devices. Xerox is planning to use this computational model to improve the efficiency of their corona device.

There are many similar examples of technology transfer with other companies.

Clarkson Vice Provost S.V. Babu Featured Speaker at Engineering Conferences in Japan and India

Vice Provost S. V. Babu

Clarkson University Vice Provost / Director of the Center for Advanced Materials Processing (CAMP) S.V. Babu was an invited speaker at two international engineering conferences held during the month of December. Both lectures focused on recent developments and emerging challenges in the field of chemical-mechanical planarization (CMP) of metal and dielectric films.

Babu first traveled to Chiba, Japan to speak at the SEMICON Japan 2003 conference, the world's largest exposition for semiconductor manufacturing. His lecture examined new approaches in CMP techniques that enable the development of slurries consisting of two or more abrasive materials. While in Japan he also gave two seminars at Yokohoma City University and Tokyo City University on the topic of CMP with an emphasis on colloidal aspects. His visit to Chiba was hosted by Ebara Corporation, a Japanese Corporate Member of CAMP. During this visit, Vice Provost Babu met with representatives of Kuraray Corporation and discussed the possibility of having them join CAMP as a Corporate Member.

Babu also spoke at the Indian Institute of Chemical Engineers' Chemcon 2003 conference held in Bhubaneswar, India. He was presented a Chemcon Distinguished Speaker Award at an international symposium held during this conference. In addition he received a citation, a plaque, and an honorarium. Babu, who joined Clarkson University in 1981, has been a Visiting Scientist at Bell Communications Research Center in New Jersey, at the Niels Bohr Institute in Denmark, and at the International Center of Theoretical Physics in Italy. He has also been a Visiting Professor at the Sandia National Laboratory in New Mexico and at IBM in Endicott, New York, and taught at IIT, Kanpur in India. In 2002 he was invited by the Board of Directors of the Korean Society of Industrial and Engineering Chemistry (KSIEC) to present the first Dongjin Lecture (titled "Recent Progress and Emerging Challenges in Chemical-Mechanical Planarization") in Korea. His research endeavors are primarily in the area of materials processing with a strong emphasis on chemical-mechanical planarization, thin film etching, and deposition techniques. In addition he is the co-author of over 160 papers and 20 patents.