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CAMP Annual Report: Page 7

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Clarkson University’s Center for Advanced Materials Processing (CAMP) Sponsors the Sixteenth Consecutive International Symposium on Chemical-Mechanical Planarization

 

CMP Meeting 

The CMP Symposium Featured Two Speakers.  From left: Lee Cook (Technology Fellow, Dow Electronic Materials), Keynote Speaker Dr. Manabu Tsujimura (Director and CTO of Ebara Corporation in Japan),  Provost Thomas Young (Clarkson University), Keynote Speaker Dr. Ken Cadien (University of Alberta, Canada), and S.V. Babu (Distinguished University Professor / CAMP Director, Clarkson University).

CMP Meeting 2011

Co-organizers of the 16th International Symposium on Chemical –Mechanical Planarization.  From left: Anurag Jindal (CMP Process Engineer, Micron), Jin-Goo Park (Professor, Department of Materials Engineering, Hanyang University, Korea), Donald Canaperi (Senior Engineer at IBM), Manabu Tsujimura (Director and CTO of Ebara Corporation in Japan), S.V. Babu (Distinguished University Professor / CAMP Director, Clarkson University), and Lee Cook (Technology Fellow, Dow Electronic Materials). 

                 

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A number of researchers from several high technology companies and suppliers and some Universities from the United States, Japan, Korea, China, Germany, Canada, Belgium, and Taiwan, gathered in Lake Placid during August 7 – 10 for the 16th International Symposium on Chemical-Mechanical Planarization (CMP), sponsored by Clarkson’s Center for Advanced Materials Processing (CAMP).  

Chemical-Mechanical Planarization or chemical-mechanical polishing, CMP for short, is a process that uses nanosized  abrasives in a reactive, chemical slurry to polish various layers on the surface of wafers used in semiconductor fabrication to achieve nanolevel planarity. It plays a critical role in today’s microelectronics industry and is the ideal planarizing technology for use with the interlayer dielectrics and metal films used in all forms of logic and memory devices. CMP is an enabling technology that translates into faster computers, more realistic video games, smaller cell phones and more efficient performance from the various electronic devices we use daily in our homes and businesses.

S.V. Babu (Distinguished University Professor/CAMP Director, Clarkson University) again served as the lead organizer of this year’s symposium and was assisted by co-chairs Manabu Tsujimura ( Director and CTO of Ebara Corporation in Japan), Jin-Goo Park ( Professor, Department of Materials Engineering at Hanyang University, Korea), Donald Canaperi (Senior Engineer at  IBM),  Joseph Steigerwald (Intel Fellow; Technology and Manufacturing Group and Director of Chemical Mechanical Polish Technology), Matt Prince (Principal Engineer, Intel), Lee Cook (Technology Fellow, Dow Electronic Materials), and Anurag Jindal (CMP Process Engineer, Micron).

This year’s event was held in a Gordon conference type format. It focused on several fundamental aspects of chemical-mechanical planarization including particle and colloidal aspects, polishing mechanisms, pad/conditioning behavior, flow characterization, Cu/barrier film planarization, defects and post-polish cleaning, low-k films and integration issues, 300 mm wafer issues, MEMS / MOEMS, as well as STI, Nitride/Poly, etc. polishing.

Invited speakers from end-users, tool, pad and slurry manufacturers, and universities presented their research results.  The Symposium also included a poster session and two after-dinner keynote speakers. Monday night’s keynote speaker Dr. Ken Cadien (University of Alberta, Canada) delivered an insightful talk titled “Science and Technology of CMP.” Tuesday evening’s keynote speaker Dr. Manabu Tsujimura (Ebara Corporation, Japan) cleverly described Enabling Solutions below 20 nm (Paradigm Shift 20).