Background Image

CAMP Annual Report: Page 8

In this Section


Co-organizers of the 13th International Symposium on Chemical –Mechanical Planarization.  From left:  CAMP Professor Yuzhuo Li, Dr. Mansour Moinpour, Engineering Manager for Materials Enabling and Path Finding Programs of Intel Corporation, Dr.  Manabu Tsujimura, Managing Executive Officer and Deputy Group Executive of Ebara Corporation in Japan, Clarkson Distinguished University Professor/CAMP Director S.V. Babu, and , Dr. Mahadevaiyer Krishnan, Research Scientist and Manager for Colloid and Interface Science, Advanced Planarization Group of IBM.

Clarkson University’s Center for Advanced Materials  Processing Sponsors the Thirteenth  International Symposiun on Chemical-Mechanical Planarization

More than 100 of the world’s premier researchers, academics, high technology companies and suppliers gathered in Lake Placid August 10 – 13 for the 13th International Chemical-Mechanical Planarization (CMP) Symposium, sponsored by Clarkson’s Center for Advanced Materials Processing (CAMP).  This conference attracted companies throughout the United States and from other Countries.  Industrial participants included Nitta Haas Inc., JSR Corporation, Ebara Corporation, and Hitachi Ltd.  from Japan.  BASF of Taiwan, BASF and Evonik Degussa GmbH of Germany, and Samsung Electronics Co., Ltd. of Korea were also present.  In addition, the following U.S. companies were in attendance:  NXP, IBM, Pall Corporation, Texas Instruments, Fujimi Corporation, Intel, SKW Associates, Inc., NexPlanar, Araca Incorporated, Air Products, Semplastics, Saint Gobain, Cabot Microelectronics Corporation, innoPad Inc., Rohm & Haas, Ferro Corporation, AMD, Nyacol Nano Technologies, Inc., Degussa Corporation, JSR Micro Inc., 3M, W.R. Grace, Entegris, Inc., and Morgan Advanced Ceramics, Inc.

Chemical-Mechanical Planarization or chemical-mechanical polishing, CMP for short, is a process using nanoabrasives in a reactive, chemical slurry to polish the surface of wafers used in semiconductor fabrication to achieve nanolevel planarity.

Clarkson Distinguished University Professor/CAMP Director S.V. Babu served as the leading organizer and co-chair of the symposium. Additional co-organizers included Dr. Manabu Tsujimura, Managing Executive Officer and Deputy Group Executive of Ebara Corporation in Japan, Dr. Mansour Moinpour, Engineering Manager for Materials Enabling and Path Finding Programs of Intel Corporation, Dr. Mahadevaiyer Krishnan, Research Scientist and Manager for Colloid and Interface Science, Advanced Planarization Group of IBM, and CAMP Professor Yuzhuo Li.

Chemical-Mechanical Planarization is playing an increasingly important role in today’s microelectronics industry. It is the ideal, and the only planarizing technology for use with the interlayer dielectrics and metal films used in silicon integrated circuit fabrication. CMP is an enabling technology that translates into faster computers, more realistic video games, smaller cell phones and smaller, more efficient performance from the electronic devices we use daily in our homes and businesses.

 This year’s Symposium focused on several fundamental aspects of CMP, which included particles,  polishing mechanisms, pad behavior, flow characterization, defects and post-polish cleaning, low-k films and integration issues, 300 mm wafer challenges and MEMS/MOEMS (micro-electro-mechanical systems/micro-opto-electro-mechanical systems).

Invited speakers from end-users, tool, pad and slurry manufacturers, and universities presented their research results. In addition Dr. Joseph Steigerwald (Engineering Group Leader for Intel Corporation’s Portland Technology Development) gave an after-dinner presentation. His talk was titled “Challenges of Integrating CMP.”

Next Page

Biosensors, Microencapsulation Techniques, and Antioxidant Activity

Chemistry and Biomolecular Science Professor Silvana Andreescu is currently working on biosensors, microencapsulation techniques, and study of the antioxidant activity of engineered nanoparticles. Her group is developing multifunctional biocapsules with immobilized cells and enzymes that can be used in several practical applications including alternative energy and removal/detoxification of contaminants (e.g. arsenic, phenolic estrogens) from environmental matrices. In a collaborative project, the group is fabricating biocapsules containing appropriate biological material (yeast and enzymes) that will provide fermentation capacity of the two major products of both cellulose and hemicellulose hydrolysis: D-xylose and D-glucose. The final goal of this project is to develop a technology for the efficient production of ethanol from cellulosic biomass. In the field of biosensors, they are interested in both fundamental and practical aspects of biosensors’ technology. For example, they have studied the surface chemistry and the interactions of metal nanoparticles with native and genetically engineered proteins containing histidine and cysteine residues at the carboxyl or amino terminal group and used this system to site-specifically immobilize proteins onto electrode surfaces and develop simple and highly sensitive biosensors for the determination of glucose and organophosphorous pesticides. These biosensors are applied for the detection of these analytes in food samples. Another example is the development of biosensors for real-time monitoring of neurological activity in oxygen restrictive environments (e.g. in vivo implantable devices).  This technology utilizes fully biocompatible materials in conjunction with enzymes and nanostructured metal oxide composites to provide capabilities for operation in environments with low oxygen concentrations, to be implantable and interference free. In another project, she is investigating the potential antioxidant activity of several types of nanoparticles and their ability to scavenge and inactivate free radicals, in the same way as natural antioxidants do. Other interests are in chemical education for designing new experiments for her chemistry labs with relevance to nanobiotechnology and implementing modern teaching techniques in an inquiry-based format. She is the Co-Director of the NSF-Research Experience for Undergraduate Program at Clarkson focusing on ‘Sustainable Solutions to Emerging Environmental Problems’. Her research is funded by NSF, NYSTAR and the USDA/Center for Food Sciences at Purdue University.


Nanomechanics and Nanomaterials

Professor Weiqiang Ding’s research interests are in the fields of nanomaterials and nanocomposites. His work focuses on nanomaterial mechanics, micro/nano-scale adhesion, and polymer nanocomposites fabrication and characterization. One ongoing project in Professor Ding’s Nanomechanics and Nanomaterials Laboratory is the investigation of the adhesion properties between micro/nano-scale polymer particles and different substrate surfaces.  With custom-built nanomanipulators, the surface interactions between polymer particles and a silicon substrate are experimentally explored, in both ambient and vacuum environments. His group is also working on the fabrication and characterization of nanotube and nanoparticle-reinforcedpolymer composites.