CAMP6-main.jpg

S.V. Babu

Ph.D. Theses Supervised:

  1. Collision-induced dissociation of shock-heated diatomic mole¬cules: M. Ramakrishna (1977).
  2. Energy transfer in CO2 polyatomic molecule mixtures using laser induced fluorescence: P.R.M. Rao (1978); (co supervised by Dr. Y.V.C. Rao).
  3. Vibrational relaxation rate measurements in pure SO2, SO2 Ar and SO2 He mixtures: V.V.N. Kishore (1978); (co supervised by Dr. V. Subba Rao).
  4. Dissociation rate measurements in SO2 behind incident shock waves: M. Tyagaraju (1979); (co supervised by Dr. V. Subba Rao).
  5.  Phase equilibrium studies in CO2 using thermodynamic perturbation theory: Ratan Mohan (1984).
  6. Thermal, photon- and plasma-induced processes in polymers: V. Srinivasan (1986).
  7. Laser and plasma-enhanced deposi¬tion of refractory powders and films: M. David (1990).
  8. Laser and plasma-induced deposition of thin films: R. Padiyath (1993).
  9. Experimental and theoretical investigation of the excimer laser-induced ablation process: G. D'Couto (1993). 
  10. Plasma and laser-induced deposition and etching of diamondlike films: J. Seth (1993).
  11. Temperature distribution and adhesion in film-particle systems: S. Krishnan (1995).
  12. Corrosion and surface characteristics of a-C:H,F thin films: C.V. Srividya (1997).
  13. Evaluation and characterization of polyurethane chemical mechanical planarization polishing pads: K. Achuthan (1998).
  14. Chemical-mechanical polishing of thin copper films: Q. Luo (1997).
  15. Improved sub-micron particles for CMP slurries: H. Mariappan (2000).
  16. Novel slurries for CMP of metallic films: S. Ramarajan (2000)
  17. Doping and modification of diamondlike carbon films: I. Moskowitz (2001)
  18. Deposition and planarization of low-k dielectric films: V. Rajasekhar (2001)
  19. Role of film and particle properties during chemical-mechanical polishing: Y. Li (2001)
  20. Surface planarization of thin films: A. Jindal (2002) 
  21. Application of chemical mechanical planarization to charge coupled device technology: W. America (2002)
  22. Investigation of slurry systems in metal and dielectric CMP: Zhenyu Lu,  (2004)
  23. Relative roles of chemicals and abrasives in metal and dielectric chemical mechanical planarization: Jin Lu (2004)
  24. Chemical-mechanical polishing of metal and dielectric films for microelectronic applications: S. Hegde (2004)
  25. Role of slurry chemicals in chemical-mechanical planarization of copper interconnects: V. Gorantla (2004)
  26. Role of slurry chemicals in chemical-mechanical planarization of Copper: U. Patri (2005)
  27. Vesicle/Surfactant based slurries for metal planarization: Youngki Hong (2006)
  28. Carbon-based films for barrier applications: Suresh Ramakrishnan (2006)
  29. Chemical-mechanical planarization for MEMS application: Anita Natarajan (2007)
  30. Copper, barrier and Low-k film CMP processes: Vinay Meled (2007)
  31. Barrier and low-k film CMP investigations: S. Pandija (2007)
  32. Defect formation processes in CMP: V.K. Devarapalli (in progress)
  33. Evaluation of different abrasives and compositions for CMP applications: S.V. Janjam (in progress)
  34. Use of different surfactants for minimizing dishing in Cu CMP: Charan Surisetty ( in progress)
  35. Reverse selectivity slurries: Pradeep Dandu ( in Progress)

Back to Previous Page