
S.V. Babu
Contracts and Grants Administered:
In addition to the grants/contracts listed below, I am responsible from Oct. 1999, as the Director of the Center for Advanced Materials Processing (CAMP), for obtaining and administering $1,000,000/yr from NYSTAR and over $350,000/yr from corporate membership dues.
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Two Senior Research Fellowships, CSIR (India), 1975-77.
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Blast and detonation waves in reactive gas media, Ministry of Defense, Govt of India, 1978-80 (With Dr. V. Subba Rao).
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Laser catalyzed chemical reactions, CSIR (India), 1979-81 (With Dr. V. Subba Rao)
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Photoresist exposure optimization and plasma processing, IBM (Endicott), 1982-85, $62,420.
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Laser hole drilling, IBM (Endicott), 1982-83, $13,427.
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Additive bath circulation and plasma processing, IBM (Endicott), 1984-86, $53,395;
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Excimer laser induced etching, IBM (Essex Junction), 1985-86, $23,120;
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Photoresist kinetics and plasma processing, IBM (Endicott), 1985 87, $81,887. (Project costs listed under 4-8 do not include salary support for the 10 graduate students while they were at the IBM sites performing thesis research; Additional cost: ~$120,000).
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Laser induced deposition and spectroscopy, National Science Foundation, 1985 86, $38,300; matched by Clarkson University for $38,300 (with R. Patel).
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Excimer laser interaction with polymer materials, Honeywell Corp., 1985, $13,500.
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Effect of process conditions on photoresist develop rate, Department of Defense,1986-87, $40,291, (with P. Sukanek).
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Studies of optical microlithographic processes, National Science Foundation, 1987-91, $265,957, (with E. Barouch).
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RF Plasma reactor, NY State Center for Advanced Technology, 1987, $105,000.
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Monodispersed refractory particles by plasma techniques, NY State Center for Advanced Materials Processing, 1987-91, $133,030 (with D. Rasmussen).
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Reliability studies on copper polyimide device structures, Rome Air Development Center (through U. of Dayton), 1990-91, $70,052 (with D. Rasmussen).
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IBM graduate fellowship, 1990-91, $14,304.
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Excimer laser drilling of polymers and polymer composites, IBM, 1990-93, $144,992.
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Departmental Grant, IBM, 1991-94, $75,000 (with D. Rasmussen).
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RIE etching of Al and Al/Cu alloys, NY State Center for Advanced Materials Processing, $47,000, 1991-93, (with D. Rasmussen).
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AutoEtch 690 reactor for etching Al/Cu films, LAM Research, cost $288,000, 1991.
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Modeling of particle transport and deposition in a sputtering tool, SEMATECH, $83,755, 1992, (with A. Busnaina).
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Temperature distribution and its impact on adhesion and other mechanical characteristics in film-particle systems, Kodak Corp., $90,000, 1992-94, (with A. Busnaina).
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Laser surface treatment for adhesion enhancement, NY State Center for Advanced Materials Processing, $33,200, 1992-93 (with E. Sancaktar).
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24. Film and particulate deposition and etching in plasma reactors, NY State Center for Advanced Materials Processing, $46,500, 1992-93 (with A.A. Busnaina).
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25. Studies of plasma processing for pattern transfer, US Army through Princeton University, $100,000, 1992-93, (with E. Barouch).
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Studies of thin film deposition processes and chemical-mechanical polishing, NY State Center for Advanced Materials Processing, $122,842, 1993-95.
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High performance DLC coatings for electronic circuits, Teledyne, $105,000, 1993-96.
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Thin film resistors as thermal gauges, Calspan Corp., $34,403, 1993-94.
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Diamondlike carbon film coatings, Kodak Corp., $100,000, 1993-96.
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Contamination-free processing, Ultra Clean Technology, $15,987, 1994.
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Toxicity and process management for MOCVD copper precursors by quadrupole mass spectrometry, NYSERDA through CVC Products, $50,000, 1994-95 (with D. Campbell).
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Thin film technologies: Combined research-curriculum development: National Science Foundation, $409,590, 1994-98, (with D. Rasmussen and I. Suni).
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Chemical-mechanical polishing, R.H. Strasbaugh, Inc., $36,036, 1995-96.
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Photo sol-gel net shape processing and laser machining/cutting of ULE glass, Kodak, $85,700, 1996-97, (with R. Mackay).
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Chemical-mechanical polishing of MOCVD copper films, NYSERDA through CVC Products, $53,500, 1996-97 (with D. Campbell).
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Rodel/Sandia Co-op project on CMP, Rodel, $36,000, 1996.
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Diamondlike carbon and fluorocarbon film coatings, Kodak Corp., $150,000, 1996-99.
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Tungsten Polishing, MiCrus, $25,240, 1996-97.
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Improved submicron particles for CMP of integrated circuit structures, NYSERDA through Ferro Corp., $100,000, 1997-98.
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MOCVD process for BST films, CVC Products, $43,000, 1997-99.
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Graduate Research Fellowship, National Science Foundation, $75,500, 1997-02.
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Diamondlike carbon (DLC) coatings for hybrid hermeticity, Teledyne Microelectronics, $30,000, 1997-98.
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Role of slurry particles and chemistry in the CMP of copper, INTEL, $70,000, 1998-2000.
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Acquisition of instrumentation for a thin film characterization facility, $158,655, National Science Foundation, and Clarkson Cost-sharing, $67,995, 1998-99 (with A. Busnaina, Y. Li, R. Mackay, and I. Suni).
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Copper CMP slurry development, Grace Davison, $41,000, 1998-99.
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Improved submicron particles for CMP of integrated circuit structures, Phase II, NYSERDA through Ferro Corp., and Ferro Corp., $194,600, 1998-2000.
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Chemical-mechanical polishing, Kodak, $200,000, 1998-2002
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Support for Ramanathan: Ferro Corp., $23,184, 1999
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Metal polishing using polishing particles: Rodel, $95,300, 1999-2001
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Development and assessment of hypermedia-based instruction in colloidal technology, National Science Foundation, $249,748, 1999-2002 (with I. Suni, D. Rasmussen, J. Fendler, and R. Mackay).
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Polishing for ultrafast devices, Advanced Vison Technologies, $48,310, 2000-01
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Polishing of metal and oxide films using silica abrasives, PPG Silicas, $86,600, 2000-01
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Investigations on the role of abrasive shape, size and morphology in chemical-mechanical polishing: Intel/SRC, $375,000, 2000-03 (with E. Matijević)
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Chemical-mechanical polishing using specialized abrasives, NYACOL, $227,000, 2000-04
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Ceria slurries & slurry development, Kodak, $120,000, 2001-04
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Magnetically-assisted CMP of low-k polymers, National Science Foundation thru Univ. of Pittsburgh, $72,776, 2001-2005
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Evaluation of slurries for CMP: JM Huber, $32,500, 2002
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Chemical-Mechanical Polishing for Micro-opto-electro-mechanical systems fabrication; Infotonics Technology Center, $232,875, 2002-05 (with J.A. Kubby, Xerox)
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Phase characteristics of cerium composite nanoparticles and CMP mechanisms: Ferro, $83,664, 2003-04
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CMP mechanisms of thin film head materials, Seagate Technology, $19,996, 2003
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Deposition of diamondlike carbon films and application of Silica-coated polymer particles, Kodak, $60,000, 2002-04
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Identification and development of unique slurries for Cu and Low-k CMP, Climax Engineered Materials, $197,000, 2003-05.
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Preparation of metallic and metal composite particles for obscurant smokes: Defense Army Acquisitions Division, $1,350,000, 2003-04 (with D. Goia and R. Partch)
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Evaluation of a novel conditioner for CMP, TBW Industries, $40,000, 2003-04 (with Y. Li)
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Investigation of semiporous polymeric interlevel dielectric films for use in multilevel metallization structures, Intel/SRC, $380,000, 2003-06 (with E. Matijević)
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Retainer Ring Project: St. Gobain, $29,478, 2003-04
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Joint research Support for Dorfman, NanoDynamics, $84,721, 2004-06
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Preparation of metallic and metal composite particles for obscurant smokes: Defense Army Acquisitions Division, $2,713,100, 2004-06 (with D. Goia and R. Partch)
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Copper and Tantalum disk polishing, UOP, $35,000, 2004-05
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Evaluation of ceria abrasives, UMICORE, $15,000, 2004
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Optimized CMP process, Corning, $30,000, 2004-05
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Effect of polymer particles in barrier CMP slurry, JSR Chemicals, $70,000, 2005-07
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Smart responsive nanostructures for soldier protection, Army Research Office, $1,428,574, 2005 - 09
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NYSTAR CAT Development 2, Ferro Project, $105,392, 2007-08, (with I. Sokolov)
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Industrial Firm research project: Free Form Fibers, $170,697, 2007-08
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Evaluation and optimization of formulation for STI and ILD, Rhodia, $101,500, (2006-08)
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New abrasives and dispersions for barrier film CMP, BASF, $140,000, 2007-09 (with R. Partch)
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Chemical mechanical planarization, Micron Foundation, $135,206, 2007-09 (with R. Partch)
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Planarization of Cu and Ta films/patterned structures and evaluation of compatibility with low-k dielectric films, IBM through SRC, $60,000, 2008-09 (with Prof. Roy)
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Preliminary Evaluation of CMP pads: WL Gore, $10,000, 2008
