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  • Among CAMP researchers' notable achievements in CMP are Professor Babu's early collaboration with the Eastman Kodak Company and Ferro which has resulted in patents for a slurry composition for the STI process. This research with Kodak also resulted in several patents that involve the application of diamond-like carbon films and low pressure plasma processing for adhesion enhancement and surface cleaning.
  • Professor Yuzhuo Li's research group is currently developing new chemicals/slurries for different metal CMP applications and Electro Chemical Mechanical Planaraization (ECMP) applications.
  • Since 1995, CAMP has sponsored the annual International Chemical-Mechanical Planaraization Symposium. The event attracts the world's premier CMP researchers, as well as high technology companies, including IBM, Intel, St. Gobain, Rohm & Haas, Ferro, Micron, Fujimi, Cabot Micro, DA Nano, Unicore, BASF, JSR, Hitachi and EBARA among others.